All 'electronic circuits and systems' publications

Journal Articles

1. Parion, Jonathan; Scaffidi, Romain; Duerinckx, Filip; Sivaramakrishnan, Hariharsudan; Flandre, Denis; Poortmans, Jef; Vermang, Bart. Comparative study of the interface passivation properties of LiF & Al2O3 using silicon MIS capacitor. In: Applied Physics Letters, Vol. 124, no.14, p. 142901 (2024). doi:10.10363/5.0203484. http://hdl.handle.net/2078.1/286543

2. Masarweh, Eléonore; Arseenko, Mariia; Guaino, Philippe; Flandre, Denis. Membrane-based mechanical characterization of screen-printed inks: Deflection analysis of ink layers on polyimide membranes. In: Applied Research, (2024). doi:10.1002/appl.202300113 SECTIONS. http://hdl.handle.net/2078.1/285599

3. Lefebvre, Martin; Bol, David. MANTIS: A Mixed-Signal Near-Sensor Convolutional Imager SoC Using Charge-Domain 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection. In: IEEE Journal of Solid State Circuits, (2024). doi:10.1109/JSSC.2024.3484766 (Accepté/Sous presse). http://hdl.handle.net/2078.1/293316

4. Lefebvre, Martin; Bol, David. A 2.5-nA Area-Efficient Temperature-Independent 176-/82-ppm/°C CMOS-Only Current Reference in 0.11-µm Bulk and 22-nm FD-SOI. In: IEEE Journal of Solid-State Circuits, Vol. 59, no. 11, p. 3752-3766 (November 2024). doi:10.1109/jssc.2024.3402960. http://hdl.handle.net/2078.1/288064

5. Zeng, Xi; Zhukova, Maria; Faniel, Sébastien; Li, Guoli; Flandre, Denis. Properties and Aging of Bottom-Contact CuO/Au Transmission Line Model (TLM) Structures. In: IEEE Transactions on Electron Devices, p. 6254-6260 (2024). http://hdl.handle.net/2078.1/290715

6. Lefebvre, Martin; Bol, David. A nA-Range Area-Efficient Sub-100-ppm/°C Peaking Current Reference Using Forward Body Biasing in 0.11-µm Bulk and 22-nm FD-SOI. In: IEEE Journal of Solid-State Circuits, (2024). doi:10.1109/jssc.2024.3406423 (Accepté/Sous presse). http://hdl.handle.net/2078.1/288265

7. Hong, Ruohao; He, Penghui; Zhang, Sen; Hong, Xitong; Tian, Qianlei; Liu, Chang; Bu, Tong; Su, Wanhan; Li, Guoli; Flandre, Denis. Compositional Engineering of Cu-Doped SnO Film for Complementary Metal Oxide Semiconductor Technology. In: Nano Letters : a journal dedicated to nanoscience and nanotechnology, Vol. 24, no.4, p. 1176-1183 (2024). doi:10.1021/acs.nanolett3c03953. http://hdl.handle.net/2078.1/287695

8. Golard, Louis; Dethienne, Robin; Louveaux, Jérôme; Bol, David. A parametric life-cycle model for assessing environmental impacts of 4G and 5G cellular base stations. In: The International Journal of Life Cycle Assessment, (2024). (Soumis). http://hdl.handle.net/2078.1/295274

9. Gauthier Roussilhe; Pirson, Thibault; Mathieu Xhonneux; Bol, David. From silicon shield to carbon lock-in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020). In: Journal of Industrial Ecology, Vol. 28, no.5, p. 1212-1226 (2024). doi:10.1111/jiec.13487. http://hdl.handle.net/2078.1/292186

10. Xu, Pengcheng; Flandre, Denis; Bol, David. Analysis and Design of RF Energy-Harvesting Systems with Impedance-Aware Rectifier Sizing. In: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—II: EXPRESS BRIEFS, Vol. 70, no. 2, p. 367-365 (2023). doi:10.1109/TCSII.2022.3171470 (Accepté/Sous presse). http://hdl.handle.net/2078.1/264155

11. Vanbrabant, Martin; Raskin, Jean-Pierre; Flandre, Denis; Kilchytska, Valeriya. Impact of thermal coupling effects on the digital and analog figures of merit of UTBB SOI MOSFET pairs. In: Solid - State Circuits, Vol. 2023, p. 108623 (2023). doi:10.1016/j.sse.2023.108623. http://hdl.handle.net/2078.1/283154

12. Qaderi, Fatemeh; Rosca, Teodor; Burla, Maurizio; Leuthold, Juerg; Flandre, Denis; Ionescu, Adrian M. Millimeter-wave to near-terahertz sensors based on reversible insulator-to-metal transition in VO2. In: Communications Materials, , no.34 (2023). doi:10.1038/s43246-023-00350-x. http://hdl.handle.net/2078.1/283150

13. Xie, Zhengdao; Li, Guoli; Xia, Shengxuan; Liu, Chang; Zhang, Sen; Flandre, Denis. Ultimate Limit in Optoelectronic Performances of Monolayer WSe2 Sloping-Channel Transistors. In: Nano Letters : a journal dedicated to nanoscience and nanotechnology, Vol. 23, p. 6664-6672 (2023). doi:10.1021/acs.nanolett.3c01866. http://hdl.handle.net/2078.1/283147

14. Afzalian, Aryan; Flandre, Denis. Ultra-Scaled Si Nanowire Biosensors for Single DNA Molecule Detection. In: Sensors, Vol. 23, no.12, p. 5405 (2023). doi:10.3390/s23125405. http://hdl.handle.net/2078.1/283148

15. Puyol Troisi, Rafael; Walewyns, Thomas; Francis, Laurent; Flandre, Denis. Design of Ultra-Low-Power Sensor Readout Circuits Through Adaptive Biasing for Gas Monitoring With Chemiresistive Sensors. In: IEEE Sensors Journal, Vol. 23, no.22, p. 27468-27477 (2023). doi:10.1109/JSEN.2023.3322393. http://hdl.handle.net/2078.1/283145

16. Lefebvre, Martin; Flandre, Denis; Bol, David. A 1.1- / 0.9-nA Temperature-Independent 213- / 565-ppm/°C Self-Biased CMOS-Only Current Reference in 65-nm Bulk and 22-nm FDSOI. In: IEEE Journal of Solid-State Circuits, Vol. 58, no. 8, p. 2239-2251 (August 2023). doi:10.1109/jssc.2023.3240209. http://hdl.handle.net/2078.1/272466

17. Golard, Louis; Louveaux, Jérôme; Bol, David. Evaluation and projection of 4G and 5G RAN energy footprints: the case of Belgium for 2020–2025. In: Annales des Télécommunications, Vol. online (2023). doi:10.1007/s12243-022-00932-9. http://hdl.handle.net/2078.1/267972

18. Kaziz, Sinda; Hadj Said, Mohamed; Imburgia, Antonino; Maamer, Bilel; Flandre, Denis; Romano, Pietro; Tounsi, Fares. Radiometric Partial Discharge Detection: A Review. In: energies, Vol. 16, no.4, p. 1978 (2023). doi:10.3390/en16041978. http://hdl.handle.net/2078.1/272892

19. D. Martinez-Perez, Antonio; Aznar, Francisco; Flandre, Denis; Celma, Santiago. Design-Window Methodology for Inductorless Noise-Cancelling CMOS LNAs. In: I E E E Access, Vol. 10, p. 29482-29492 (2022). doi:10.1109/ACCESS.2022.3158356. http://hdl.handle.net/2078.1/259751

20. Oliveira, Kevin; P. Teixeira, Jennifer; Chen, Wei-Chao; Lontchi Jioleo, Jackson; J. N. Oliveira, António; Çaha, Ihsan; Deepak Francis, Leonard; Flandre, Denis; Edoff, Marika; A. Fernandes, Paulo; M. P. Salomé, Pedro. SiOx Patterned Based Substrates Implemented in Cu(In,Ga)Se2 Ultrathin Solar Cells: Optimum Thickness. In: IEEE JOURNAL OF PHOTOVOLTAICS, , p. 8 (2022). (Accepté/Sous presse). http://hdl.handle.net/2078.1/260533

21. Vanbrabant, Martin; Raskin, Jean-Pierre; Flandre, Denis; Kilchytska, Valeriya. Experimental study of thermal coupling effects in FD-SOI MOSFET. In: Solid-State Electronics, Vol. 194, no.108362, p. 4 (2022). doi:10.1016/j.sse.2022.108362. http://hdl.handle.net/2078.1/260779

22. Van Brandt, Léopold; Saeidi, Roghayeh; Bol, David; Flandre, Denis. Accurate and Insightful Closed-Form Prediction of Subthreshold SRAM Hold Failure Rate. In: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—I: REGULAR PAPERS, Vol. 69, no.7, p. 2767-2780 (2022). doi:10.1109/TCSI.2022.3164680. http://hdl.handle.net/2078.1/264157

23. Dekimpe, Rémi; Bol, David. ECG Arrhythmia Classification on an Ultra-Low-Power Microcontroller. In: IEEE Transactions on Biomedical Circuits and Systems, Vol. 16, no.3, p. 456-466 (2022). http://hdl.handle.net/2078.1/268570

24. Puyol Troisi, Rafael; Pétré, Sylvain; Danlée, Yann; Walewyns, Thomas; Francis, Laurent; Flandre, Denis. An Ultra-Low-Power Read-Out Circuit for Interfacing Novel Gas Sensors Matrices. In: IEEE Sensors Journal, Vol. 22, no.10, p. 9521-9533 (2022). doi:10.1109/JSEN.2022.3165755. http://hdl.handle.net/2078.1/260786

25. Yan, Yiyi; Kilchytska, Valeriya; Flandre, Denis; Raskin, Jean-Pierre. Investigation and optimization of traps properties in Al2O3/SiO2 dielectric stacks using conductance method. In: Solid-State Electronics, Vol. 194, p. 4 (2022). doi:10.1016/j.sse.2022.108347. http://hdl.handle.net/2078.1/260500

26. He, Penghui; Ding, Chunchun; Li, Guoli; Hu, Wei; Ma, Chao; Flandre, Denis; Iñíguez, Benjamín; Liao, Lei; Lan, Lingfeng; Liu, Xingqiang. Enhanced Stability and Mobility of Solution-Processed Oxide Thin-Film Transistors with Bilayer Terbium-incorporated Indium Oxide Channel. In: Applied Physics Letters, Vol. 121, no.19, p. 21 (2022). http://hdl.handle.net/2078.1/266612

27. Lefebvre, Martin; Bol, David. A Family of Current References Based on 2T Voltage References: Demonstration in 0.18-μm With 0.1-nA PTAT and 1.1-μA CWT 38-ppm/°C Designs. In: IEEE Transactions on Circuits and Systems I: Regular Papers, Vol. 69, no. 8, p. 3237-3250 (August 2022). doi:10.1109/TCSI.2022.3172647. http://hdl.handle.net/2078.1/260735

28. Schramme, Maxime; Van Brandt, Léopold; Flandre, Denis; Bol, David. Comprehensive Analytical Comparison of Ring Oscillators in FDSOI Technology: Current Starving Versus Back-Bias Control. In: IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—I: REGULAR PAPERS, Vol. 69, no. 5, p. 1883-1895 (2022). doi:10.1109/TCSI.2022.3144527. http://hdl.handle.net/2078.1/258018

29. Kaziz, Sinda; Romano, Pietro; Imburgia, Antonino; Ala, Guido; Sghaier, Halim; Flandre, Denis; Tounsi, Fares. PCB-Based Planar Inductive Loops for Partial Discharges Detection in Power Cables. In: Sensors, Vol. 23, no.1, p. 290 (2022). doi:10.3390/s23010290. http://hdl.handle.net/2078.1/272245

30. Tounsi, Fares; Hadj Said, Mohamed; Hauwaert, Margo; Kaziz, Sinda; Francis, Laurent; Raskin, Jean-Pierre; Flandre, Denis. Variation Range of Different Inductor Topologies with Shields for RF and Inductive Sensing Applications. In: Sensors, Vol. 22, no.9, p. 15 (2022). doi:10.3390/s22093514. http://hdl.handle.net/2078.1/260806

31. Zeng, Xi; Lontchi Jioleo, Jackson; Zhukova, Maria; Fourdrinier, Lionel; Qadir, Israr; Ren, Yi; Niemi, Esko; Li, Guoli; Flandre, Denis. High-responsivity broadband photodetection of an ultra-thin In2S3/CIGS heterojunction on steel. In: Optics Letters, Vol. 46, no.10, p. 2288-2291 (2021). doi:10.1364/OL.423999. http://hdl.handle.net/2078.1/248722

32. Chen, Qi; Li, Guoli; André, Nicolas; Liu, Xingqiang; Xia, Zhen; Flandre, Denis; Liao, Lei. Origin of Low-Temperature Negative Transconductance in Multilayer MoS2 Transistors. In: Applied Physics Letters, , p. 10 (2021). doi:10.1063/5.0058545 (Accepté/Sous presse). http://hdl.handle.net/2078.1/249728

33. M. V. Cunha, José; Barreiros, M. Alexandra; Curado, Marco A.; Lopes, Tomás S.; Oliveira, Kevin; Oliveira, António J. N.; Barbosa, João R. S.; Vilanova, António; Brites, Maria João; Mascarenhas, João; Flandre, Denis; Silva, Ana G.; Fernandes, Paulo A.; Salomé, Pedro M. P. Perovskite Metal–Oxide–Semiconductor Structures for Interface Characterization. In: Advanced Materials Interfaces, , p. 1-12 (2021). doi:10.1002/admi.202101004. http://hdl.handle.net/2078.1/251370

34. Scaffidi, Romain; Buldu, Dilara G.; Brammertz, Guy; Kohl, Thierry; Birant, Gizem; Meuris, Marc; Poortmans, Jef; Flandre, Denis; Vermang, bart. Comparative study of Al2O3 and HfO2 for surface passivation of Cu(In,Ga)Se2 thin-films: An innovative Al2O3/HfO2 multi-stack design. In: Physica Status Solidi A, (2021). doi:10.1002/pssa.202100073. http://hdl.handle.net/2078.1/248737

35. Dekimpe, Rémi; Bol, David. A Configurable ULP Instrumentation Amplifier with Pareto-Optimal Power-Noise Trade-Off Achieving 1.93 NEF in 65nm CMOS. In: IEEE Transactions on Circuits and Systems. Part 2: Express Briefs, Vol. 68, no.7, p. 2272-76 (2021). doi:10.1109/TCSII.2021.3059311. http://hdl.handle.net/2078.1/248911

36. Bol, David; Schramme, Maxime; Moreau, Ludovic; Xu, Pengcheng; Dekimpe, Rémi; Saeidi, Roghayeh; Haine, Thomas; Frenkel, Charlotte; Flandre, Denis. SleepRunner: A 28-nm FDSOI ULP Cortex-M0 MCU With ULL SRAM and UFBR PVT Compensation for 2.6–3.6-μW/DMIPS 40–80-MHz Active Mode and 131-nW/kB Fully Retentive Deep-Sleep Mode. In: IEEE Journal of Solid State Circuits, Vol. 56, no.7, p. 2256-2269 (2021). doi:10.1109/JSSC.2021.3056219. http://hdl.handle.net/2078.1/248907

37. Kneip, Adrian; Bol, David. Impact of Analog Non-Idealities on the Design Space of 6T-SRAM Current-Domain Dot-Product Operators for In-Memory Computing. In: IEEE Transactions on Circuits and Systems Part 1: Regular Papers, Vol. 68, no.5, p. 1931-1944 (2021). doi:10.1109/TCSI.2021.3058510. http://hdl.handle.net/2078.1/246615

38. GALEMBECK, EGON HENRIQUE SALERNO; Renaux, Christian; SWART, JACOBUS WILLIBRORDUS; Flandre, Denis; GIMENEZ, SALVADOR PINILLOS. The Impact of LCE and PAMDLE Regarding Different CMOS ICs Nodes and High Temperatures. In: I E E E Journal of the Electron Devices Society, Vol. 9, p. 415-423 (2021). doi:10.1109/JEDS.2021.3071399. http://hdl.handle.net/2078.1/248485

39. Tapperel, Joachim; Xhonneux, Mathieu; Bol, David; Louveaux, Jérôme; Burg, Andras. Enhancing the Reliability of Dense LoRaWAN Networks With Multi-User Receivers. In: IEEE Open Journal of the Communications Society, Vol. 2, p. 2725-2738 (2021). doi:10.1109/OJCOMS.2021.3134091. http://hdl.handle.net/2078.1/260532

40. Moreau, Nicolas; Pirson, Thibault; Le Brun, Grégoire; Delhaye, Thibault; Sandu, Georgiana; Paris, Antoine; Bol, David; Raskin, Jean-Pierre. Could Unsustainable Electronics Support Sustainability. In: Sustainability, Vol. 13, no. 6541, p. 7 (2021). doi:10.3390/su13126541. http://hdl.handle.net/2078.1/251547

41. Xhonneux, Mathieu; Afisiadis, Orion; Bol, David; Louveaux, Jérôme. A Low-Complexity LoRa Synchronization Algorithm Robust to Sampling Time Offsets. In: IEEE Internet of Things Journal, , p. 14 (2021). doi:10.1109/JIOT.2021.3101002 (Accepté/Sous presse). http://hdl.handle.net/2078.1/251518

42. Nait Saada, Tamazouzt; Pang, Liuqing; Sravan Kumar, Kilaparthi; H.B. Dourado, André; D. Germano, Lucas; D. Vicentini, Eduardo; P.L. Batista, Ana; G.S. de Oliveira-Filho, Antonio; Dumeignil, Franck; Paul, Sébastien; Wojcieszak, Robert; Melinte, Sorin; Sandu, Georgiana; Petretto, Guido; Rignanese, Gian-Marco; Henrique Braga, Adriano; F. Rosado, Taissa; Meziane, Dalila; Boukherroub, Rabah; I. Córdoba de Torresi, Susana; G.M. da Silva, Anderson; Szunerits, Sabine. The importance of the shape of Cu2O nanocrystals on plasmon-enhanced oxygen evolution reaction in alkaline media. In: Electrochimica Acta, Vol. 390, p. 138810 (2021). doi:10.1016/j.electacta.2021.138810. http://hdl.handle.net/2078.1/249120

43. Schwarz, Mike; Kloes, Alexander; Flandre, Denis. Temperature-dependent performance of Schottky-Barrier FET ultra-low-power diode. In: Solid-State Electronics, Vol. 184, no.108124, p. 8 (2021). doi:10.1016/j.sse.2021.108124. http://hdl.handle.net/2078.1/248657

44. Roisin, Nicolas; Brunin, Guillaume; Rignanese, Gian-Marco; Flandre, Denis; Raskin, Jean-Pierre. Indirect light absorption model for highly strained silicon infrared sensors. In: Journal of Applied Physics, Vol. 30, no.5, p. 30 (2021). doi:10.1063/5.0057350 (Accepté/Sous presse). http://hdl.handle.net/2078.1/249729

45. Sabri Alirezaei, Iman; André, Nicolas; Amor, Sedki; Gérard, Pierre; Flandre, Denis. An Ultra-Thin Ultraviolet Enhanced Backside- Illuminated Single-Photon Avalanche Diode with 650nm-Thin Silicon Body Based on SOI Technology. In: IEEE Journal of Selected Topics in Quantum Electronics, , p. 11 (2021). doi:10.1109/JSTQE.2021.3129274. http://hdl.handle.net/2078.1/253906

46. Storrer, Laurent; Yildirim, Hasan Can; Crauwels, Morgane; Pocoma Copa, Evert I.; Pollin, Sofie; Louveaux, Jérôme; De Doncker, Philippe; Horlin, François. Indoor Tracking of Multiple Individuals With an 802.11ax Wi-Fi-Based Multi-Antenna Passive Radar. In: IEEE Sensors Journal, Vol. 21, no.18, p. 20462-20474 (2022). http://hdl.handle.net/2078.1/265280

47. Frenkel, Charlotte; Lefebvre, Martin; Bol, David. Learning Without Feedback: Fixed Random Learning Signals Allow for Feedforward Training of Deep Neural Networks. In: Frontiers in Neuroscience, Vol. 15, p. 629892 (2021). doi:10.3389/fnins.2021.629892. http://hdl.handle.net/2078.1/245286

48. Wei, Peng; Sabri Alirezaei, Iman; André, Nicolas; Zeng, Xi; Bouterfa, Mohamed; Wang, Bin; Zeng, Yun; Flandre, Denis. The Shift of Breakdown Voltage for Silicon Membrane Strip Detectors Resulting from Surface Avalanche. In: Journal of Applied Physics, Vol. 129, no.21, p. 214501-1/7 (2021). doi:10.1063/5.0049490. http://hdl.handle.net/2078.1/246703

49. Pirson, Thibault; Bol, David. Assessing the embodied carbon footprint of IoT edge devices with a bottom-up life-cycle approach. In: Journal of Cleaner Production, Vol. 322, no. 128966, p. 13 (2021). doi:10.1016/j.jclepro.2021.128966. http://hdl.handle.net/2078.1/251545

50. Zhukova, Maria; Kotipalli, Ratan; PONCELET, Olivier; Samain, Louise; Fourdrinier, Lionel; Flandre, Denis. Correlation and optimization of the optoelectrical properties of DC magnetron-sputtered Cu2ZnSnS4 absorber layer as a function of the material composition. In: Materials Science in Semiconductor Processing, Vol. 121, no.105307, p. 1-11 (2021). doi:10.1016/j.mssp.2020.105367. http://hdl.handle.net/2078.1/249828

51. Schramme, Maxime; Gimeno Gasca, Cecilia; Cathelin, Andreia; Flandre, Denis; Bol, David. A 2.5-GHz Clock Recovery Circuit Based on a Back-Bias-Controlled Oscillator in 28-nm FDSOI. In: IEEE Solid-State Circuits Letters, Vol. 3, p. 478-481 (2020). doi:10.1109/LSSC.2020.3026759. http://hdl.handle.net/2078.1/235852

52. Galy, Philippe; Soto, F.; Bourgeat, J.; Jacquier, B.; Kilchytska, Valeriya; Flandre, Denis. Experimental results on diodes and BIMOS ESD devices in 28 nm FD-SOI under TLP & TID radiation. In: Microelectronics Reliability, Vol. 114, p. 113938 (2020). doi:10.1016/j.microrel.2020.113938. http://hdl.handle.net/2078.1/237494

53. Wan, Da; Hao, Huang; CHEN, Chen; Abliz, Ablat; Ye, Cong; Liu, Xingqiang; Zou, Xuming; Li, Guoli; Flandre, Denis; Liao, Lei. High Voltage Gain WSe2 Complementary Compact Inverter With Buried Gate for Local Doping. In: IEEE Electron Device Letters, Vol. 41, no.6, p. 944-947 (2020). doi:10.1109/LED.2020.2988488. http://hdl.handle.net/2078.1/229960

54. Levi, Itamar; Bellizia, Davide; Bol, David; Standaert, François-Xavier. Ask Less, Get More: Side-Channel Signal Hiding, Revisited. In: IEEE Transactions on Circuits and Systems Part 1: Regular Papers, Vol. 67, no.12, p. 4904 - 4917 (2020). doi:10.1109/TCSI.2020.3005338. http://hdl.handle.net/2078.1/239167

55. Stoukatch, Serguei; André, Nicolas; Delhaye, Thibault; Dupont, François; Redouté, Jean-Michel; Flandre, Denis. Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. In: IEEE Sensors, Vol. 2020, p. 1-4 (2020). doi:10.1109/SENSORS47125.2020.9278669. http://hdl.handle.net/2078.1/243580

56. Gimeno Gasca, Cecilia; Flandre, Denis; Schramme, Maxime; Frenkel, Charlotte; Bol, David. A 2.24-pJ/bit 2.5-Gb/s UWB receiver in 28-nm FDSOI CMOS for low-energy chip-to-chip communications. In: A E Ue: International Journal of Electronics and Communication, Vol. 114, no. 152996, p. 8 (2020). doi:10.1016/j.aeue.2019.152996. http://hdl.handle.net/2078.1/223380

Patents

1. Xu, Pengcheng; Bol, David; Flandre, Denis. Energy harvesting system. http://hdl.handle.net/2078.1/283160 http://hdl.handle.net/2078.1/283160

2. Roisin, Nicolas; Flandre, Denis; André, Nicolas; Delhaye, Thibault. Strain sensor. http://hdl.handle.net/2078.1/283157 http://hdl.handle.net/2078.1/283157

Conference Papers

1. Lefebvre, Martin; Bol, David. A Mixed-Signal Near-Sensor Convolutional Imager SoC with Charge-Based 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection. In: Proceedings of the 2024 IEEE Custom Integrated Circuits Conference (CICC). p. 1-2. Institute of Electrical and Electronics Engineers (IEEE), 2024 xxx. doi:10.1109/CICC60959.2024.10528961. http://hdl.handle.net/2078.1/287450

2. Golard, Louis; Agram, Youssef; Rottenberg, François; Quitin, François; Bol, David; Louveaux, Jérôme. A Parametric Power Model of Multi-Band Sub-6 GHz Cellular Base Stations Using On-Site Measurements. In: IEEE International Symposium Personal, Indoor and Mobile Radio Communications. (2024). I E E E, 2024 xxx. doi:10.1109/PIMRC59610.2024.10817448. http://hdl.handle.net/2078.1/289070

3. Chen, Qi; Flandre, Denis. TCAD Simulation Study on P-type Source-gated CuO TFTs. 2023 xxx. http://hdl.handle.net/2078.1/281173

4. Bidoul, Noémie; Huet, Benjamin; Ureña Begara, Ferran; Raskin, Jean-Pierre; Flandre, Denis. Tuning the stochasticity of VO2 neurons firing-threshold through grain size engineering. In: Proceedings of Neuromorphic Materials, Devices, Circuits and Systems, 2023, p. 050 xxx. doi:10.29363/nanoge.neumatdecas.2023.050. http://hdl.handle.net/2078.1/272256

5. Chen, Qi; Zeng, Xi; Flandre, Denis. Impact of passivation layer on the subthreshold behavior of p-type CuO accumulation-mode thin-film transistors. 2023 xxx. http://hdl.handle.net/2078.1/281169

6. Golard, Louis; Bol, David; Louveaux, Jérôme. A Configurable RAN Model to Evaluate and Reduce its Power Consumption and Carbon Footprint. 2023 xxx. http://hdl.handle.net/2078.1/278543

7. Van Brandt, Léopold; Vercauteren, Roselien; Haya Enriquez, Diego; André, Nicolas; Kilchytska, Valeriya; Flandre, Denis; Delvenne, Jean-Charles. Variance and Skewness of Current Fluctuations Experimentally Evidenced in Single-Photon Avalanche Diodes. In: 2023 International Conference on Noise and Fluctuations (ICNF), 2023, 979-8-3503-3011-3 xxx. doi:10.1109/ICNF57520.2023.10472747. http://hdl.handle.net/2078.1/287699

8. Bidoul, Noémie; Rosca, Teodor; Ionescu, Adrian M.; Flandre, Denis. Static and Dynamic Stochastic Analysis of a Temperature-Sensitive VO2 Spiking Neuron. In: 53rd European Solid-State Device Research Conference (ESSDERC), 2023, 979-8-3503-0424-4 xxx. doi:10.1109/ESSDERC59256.2023.10268509. http://hdl.handle.net/2078.1/283155

9. Parion, Jonathan; Scaffidi, Romain; Flandre, Denis; Brammertz, Guy; Vermang, Bart. Low-temperature admittance spectroscopy for defect characterization in Cu(In,Ga)(S,Se)2 thin-film solar cells. In: IEEE EUROCON 2023 - 20th International Conference on Smart Technologies, 2023, 978-1-6654-6398-0 xxx. doi:10.1109/EUROCON56442.2023.10199008. http://hdl.handle.net/2078.1/283161

10. Chouaibi, Sana; Said, Mohammed Hadj; Nasr, Dorra; Ayed, Mossaad Ben; Flandre, Denis; Tounsi, Fares. Mutual Inductance Evaluation Between Two Parallel Conductors on a PCB. In: 30th IEEE International Conference on Electronics, Circuits and Systems (ICECS), 2023, 979-8-3503-2649-9 xxx. doi:10.1109/ICECS58634.2023.10382803. http://hdl.handle.net/2078.1/287694

11. Yildirim, Hasan Can; Storrer, Laurent; Louveaux, Jérôme; De Doncker, Philippe; Horlin, François. Impact of MU-MIMO on Passive Wi-Fi Sensing: Threat or Opportunity?. I E E E, 2022 xxx. http://hdl.handle.net/2078.1/265278

12. Storrer, Laurent; Yildirim, Hasan Can; Louveaux, Jérôme; De Doncker, Philippe; Pollin, Sophie; Horlin, François. Impact of Inter-body Scattering on People Counting with Wi-Fi Sensing. 2022 xxx. http://hdl.handle.net/2078.1/265277

13. Steaven V. Chede, Akpaki; Dossou, Michel; Louveaux, Jérôme. Joint Transmission-Sensing Framework Using Changepoint Detection. 2022 xxx. http://hdl.handle.net/2078.1/265279

14. Lefebvre, Martin; Flandre, Denis; Bol, David. A 0.9-nA Temperature-Independent 565-ppm/°C Self-Biased Current Reference in 22-nm FDSOI. In: Proceedings of the ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC). p. 469-472. Institute of Electrical and Electronics Engineers (IEEE), 2022 xxx. doi:10.1109/ESSCIRC55480.2022.9911369. http://hdl.handle.net/2078.1/266034

15. Roth, Florian; Bidoul, Noémie; Rosca, Teodor; D¨orpinghaus, Meik; Flandre, Denis; Ionescu, Adrian M.; Fettweis, Gerhard. Spike-Based Sensing and Communication for Highly Energy-Efficient Sensor Edge Nodes. 2022 xxx. http://hdl.handle.net/2078.1/260788

16. Kneip, Adrian; Lefebvre, Martin; Verecken, Julien; Bol, David. A 1-to-4b 16.8-POPS/W 473-TOPS/mm2 6T-based In-Memory Computing SRAM in 22nm FD-SOI with Multi-Bit Analog Batch-Normalization. In: ESSCIRC 2022, 2022, 978-1-6654-8494-7/2 xxx. doi:10.1109/ESSCIRC55480.2022.9911348. http://hdl.handle.net/2078.1/268575

17. Halder, Arka; Nyssens, Lucas; Rack, Martin; Lederer, Dimitri; Kilchytska, Valeriya; Raskin, Jean-Pierre. 22 nm FD-SOI MOSFET Figures of Merit at high temperatures upto 175 °C. In: SiRF 2022 Proceedings, IEEE, 2022, 978-1-6654-3469-0, p. 27-30 xxx. doi:10.1109/sirf53094.2022.9720052. http://hdl.handle.net/2078.1/262713

18. Dekimpe, Rémi; Bol, David. Mixed-Signal Compensation of Tripolar Cuff Electrode Imbalance in a Low-Noise ENG Analog Front-End. In: ESSCIRC 2022, 2022, 978-1-6654-8494-7/2 xxx. doi:10.1109/ESSCIRC55480.2022.9911326. http://hdl.handle.net/2078.1/268574

19. Kaziz, Sinda; Imburgia, Antonino; Flandre, Denis; Rizzo, Giuseppe; Romano, Pietro; Viola, Fabio; Ala, Guido; Tounsi, Fares. Performances of a PCB-based Loop Antenna Inductive Sensor for Partial Discharges Detection. p. 9-12. In: Proceedings of the 2022 IEEE 4th International Conference on Dielectrics (ICD 2022), I E E E, 2022, 978-1-6654-1833-1/22, 9-12 xxx. doi:10.1109/ICD53806.2022.9863503. http://hdl.handle.net/2078.1/267421

20. Imburgia, Antonino; Kaziz, Sinda; Romano, Pietro; Flandre, Denis; Artale, Giovanni; Rizzo, v; Viola, Fabio; Tounsi, Fares; Ala, Guido. Investigation of PCB-based Inductive Sensors Orientation for Corona Partial Discharge Detection. p. 559-563. In: proceedings of the 2022 IEEE 21st Mediterranean Electrotechnical Conference, I E E E, 2022, 978-1-6654-4280-0/22, 559-563 xxx. doi:10.1109/MELECON53508.2022.9843026. http://hdl.handle.net/2078.1/267417

21. Rack, Martin; Nyssens, Lucas; Courte, Quentin; Lederer, Dimitri; Raskin, Jean-Pierre. Impact of Device Shunt Loss on DC-80 GHz SPDT in 22 nm FD-SOI. In: ESSDERC 2021 Proceedings, IEEE, 2021, 978-1-6654-3748-6, p. 195-198 xxx. doi:10.1109/ESSDERC53440.2021.9631835. http://hdl.handle.net/2078.1/262711

22. Bol, David; Pirson, Thibault; Dekimpe, Rémi. Moore's Law and ICT Innovation in the Anthropocene. In: Proceedings of the IEEE Design, Automation and Test in Europe Conference 2021, 2021 xxx. http://hdl.handle.net/2078.1/243578

23. Zeng, Xi; Zhukova, Maria; Faniel, Sébastien; Proost, Joris; Flandre, Denis. Material, optical and electrical characterization of DC sputtered CuO by tuning oxygen concentration. In: Proceedings of the EMRS-Spring meeting 2021, 2021 xxx. http://hdl.handle.net/2078.1/248726

24. Pirson, Thibault; Bol, David; Le Brun, Grégoire; Raskin, Jean-Pierre. Can we cope with the upcoming massive deployment of IoT within environmental limits?. 2021 xxx. http://hdl.handle.net/2078.1/260531

25. Stoukatch, Serguei; André, Nicolas; Dupont, François; Redouté, Jean-Michel; Flandre, Denis. Ultra-Thinned Individual SOI Die ACF FC Bonded on Rigid and Flex PCB. In: Proceedings, IEEE, 2021, 978-0-9568086-7-7, p. 1-5 xxx. doi:10.23919/EMPC53418.2021.9584947. http://hdl.handle.net/2078.1/272252

26. Lefebvre, Martin; Moreau, Ludovic; Dekimpe, Rémi; Bol, David. A 0.2-to-3.6TOPS/W Programmable Convolutional Imager SoC with In-Sensor Current-Domain Ternary-Weighted MAC Operations for Feature Extraction and Region-of-Interest Detection. In: Proceedings of the 2021 IEEE International Solid-State Circuits Conference. p. 118-119. Institute of Electrical and Electronics Engineers (IEEE), 2021 xxx. http://hdl.handle.net/2078.1/243970

27. Dekimpe, Rémi; Schramme, Maxime; Lefebvre, Martin; Kneip, Adrian; Saeidi, Roghayeh; Xhonneux, Mathieu; Moreau, Ludovic; Gonzalez Gonzalez, Marco Antonio; Pirson, Thibault; Bol, David. SleepRider: a 5.5µW/MHz Cortex-M4 MCU in 28nm FD-SOI with ULP SRAM, Biomedical AFE and Fully-Integrated Power, Clock and Back-Bias Management. In: Proceedings of the 2021 Symposium on VLSI Circuits. p. 2 (28/07/2021). IEEE, 2021 xxx. doi:10.23919/VLSICircuits52068.2021.9492365. http://hdl.handle.net/2078.1/251534

28. Delhaye, Thibault; Roisin, Nicolas; André, Nicolas; Francis, Laurent; Flandre, Denis. Improving MOSFET Piezoresistive Strain Gauges Limit of Detection Using Lock-In Principle. In: Proceedings of the IEEE Sensors 2021, 2021 xxx. http://hdl.handle.net/2078.1/259484

29. Jain, Sameer H.; Lederer, Dimitri; Prindle, Chris; Kaltalioglu, Erdem. Novel mmWave NMOS Device for High Pout mmWave Power Amplifiers in 45RFSOI. In: ESSDERC 2021 Proceedings, IEEE, 2021, 978-1-6654-3748-6, p. 199-202 xxx. doi:10.1109/ESSDERC53440.2021.9631775. http://hdl.handle.net/2078.1/262709

30. Rack, Martin; Nyssens, Lucas; Nabet, Massinissa; Lederer, Dimitri; Raskin, Jean-Pierre. Field-Effect Passivation of Lossy Interfaces in High-Resistivity RF Silicon Substrates. In: EuroSOI-ULIS 2021 Proceedings, IEEE, 2021, 9781665437462, p. 130-133 xxx. doi:10.1109/eurosoi-ulis53016.2021.9560697. http://hdl.handle.net/2078.1/262712

31. Xhonneux, Mathieu; Louveaux, Jérôme; Bol, David. Implementing a LoRa Software-Defined Radio on a General-Purpose ULP Microcontroller. In: Proceedings of the 2021 International Workshop on Signal Processing Systems, 2021 xxx. http://hdl.handle.net/2078.1/251524

32. Amor, Sedki; Kilchytska, Valeriya; Tounsi, Fares; André, Nicolas; Francis, Laurent; Flandre, Denis. In-situ recovery of on-membrane PD-SOI MOSFET from TID defects after gamma irradiation. In: 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS), 2021, 978-1-6654-3745-5 xxx. doi:10.1109/EuroSOI-ULIS53016.2021.9560673. http://hdl.handle.net/2078.1/252876

33. Wei, Peng; André, Nicolas; Zeng, Xi; Sabri Alirezaei, Iman; Li, Guoli; Bouterfa, Mohamed; Francis, Laurent; Flandre, Denis. Micrometer-thin SOI Sensors for E-Skin Applications. In: IEEE Sensors. Proceedings. I E E E, 2020 xxx. doi:10.1109/SENSORS47125.2020.9278716. http://hdl.handle.net/2078.1/243039

34. Frenkel, Charlotte; Legat, Jean-Didier; Bol, David. A 28-nm Convolutional Neuromorphic Processor Enabling Online Learning with Spike-Based Retinas. In: Proceedings of ISCAS 2020. p. 5. IEEE, 2020 xxx. doi:10.1109/ISCAS45731.2020.9180440. http://hdl.handle.net/2078.1/236441

35. SStorrer, Laurent; Yildirim, Hasan Can; Pocoma Copa, Evert; Louveaux, Jérôme; De Doncker, Philippe; Pollin, Sofie; Horlin, François. Experimental Implementation of a Multi-Antenna 802.11ax-based Passive Bistatic Radar for Human Target Detection. 2020 xxx. http://hdl.handle.net/2078.1/265297

36. Yildirim, H.C.; Louveaux, Jérôme; De Docker, Philippe; Horlin, F.. Impact of Interference on OFDM based Radars. 2020 xxx. http://hdl.handle.net/2078.1/265306

37. Li, Guoli; He, Jiawei; Flandre, Denis; Liao, lei. Defect Engineering in n-Type Oxide Semiconductor TFTs. 2020 xxx. http://hdl.handle.net/2078.1/249252

38. Blandino, Steve; Bertrand, Thibault; Desset, Claude; Bourdoux, André; Pollin, Sofie; Louveaux, Jérôme. A Blind Beam Tracking Scheme for Millimeter Wave Systems. 2020 xxx. http://hdl.handle.net/2078.1/265301

39. Flandre, Denis; Schramme, Maxime; Gimeno Gasca, Cecilia; Drouguet, Maxime; André, Nicolas; Craeye, Christophe; Bol, David. Cinq générations de chips UWB (Ultra-Wide-Band) pour la géo-localisation et la transmission de données à très basse consommation. 2020 xxx. http://hdl.handle.net/2078.1/227585

Book Chapters

1. Pirson, Thibault; Le Brun, Grégoire; Ernesto Quisbert-Trujillo; Thomas Ernst; Raskin, Jean-Pierre; Bol, David. Towards Life Cycle Thinking and Judicious Ecodesign for the Internet of Things (IoT) Current Practices and Perspectives. In: Outlooking beyond Nanoelectronics and Nanosystems , Simon Deleonibus: New York, 2024, p. 75-136. 9781003509905. xxx xxx. doi:10.1201/9781003509905. http://hdl.handle.net/2078.1/292137

2. Bol, David; de Streel, Guerric. An 802.15.4 IR-UWB Transmitter SoC with Adaptive-FBB-Based Channel Selection and Programmable Pulse Shape. In: The Fourth Terminal, Integrated Circuits and Systems (Integrated Circuits and Systems book series (ICIR); xxx), Springer Nature Switzerland AG 2020: Switzerland, 2020, p. 223-241. 978-3-030-39495-0. xxx xxx. doi:10.1007/978-3-030-39496-7_9. http://hdl.handle.net/2078.1/236413

Working Papers

1. Charlotte Frenkel; Bol, David; Giacomo Indiveri. Bottom-Up and Top-Down Neural Processing Systems Design: Neuromorphic Intelligence as the Convergence of Natural and Artificial Intelligence. 2021. 25 p. xxx xxx. http://hdl.handle.net/2078.1/247971